The LPSC is an institute for pure research, but it also has many possibilities for technology transfer. External organisations may benefit from the direct application of research results or academic expertise, the use of laboratory apparatus, or even the use of the laboratory’s specialised workshops. These can lead to the creation of specific contracts in some innovative cases. The LPSC has a tradition of over 25 years of close collaboration with industrial partners.
    A Knowledge Transfer Partnership (KTP) may take several forms:

    • Consultancies with either an individual expert, or a research team. In the latter case the contract is with the laboratory.
    • Contracts to provide a specific service, which could be either a single transaction or on a regular basis.
    • Collaborations for strategic development of innovations, either by financing a graduate student or by the training of engineers and technicians.
    • Access to laboratory facilities, possibly with the establishment of a joint team for an R&D project.

    The principal areas of expertise of the LPSC:

    • Measurement of low radioactivity.
    • Medical imaging techniques.
    • Ion and plasma sources for implantation and treatment of surfaces.
    • Development of innovative accelerators for hadrontherapy.
    • Design and production of innovative plasma technologies, use in the production of particular particles and in surface modification.
    • Complex mechanical systems from design to manufacturing.
    • Construction of multiwire “Charpak” particle detectors.
    • Software development.
    • Design of very specific integrated electronic circuits.

    valo-electronique

    12 bits pipeline analog
    to digital converter

    valo-plasma

    Micro discharge network
    for surface treatment

    Laboratory skills

    (Specific skills in italic)

    Project and subcontractor follow up, risk analysis, project management, purchase, logistics.

    • Detectors & Instrumentation

    Gas detectors, manufacture of wire mesh, cathode metallic plans, photo detection, optical developments, command & control, data acquisition systems, embedded systems, chemistry and materials, thin films technology, photography and image processing.

    Unit tests for spatial embedded software

    • Mechanics

    Design, manufacturing and assembly of mechanical systems, comprehensive workshops with CNC machines, vacuum technologies and cryogenic systems, thermal and thermomechanical analysis, thermalization systems for low temperature, modern design (dedicated CAD facilities) and mechanical simulations. CAM manufacturing software, boilermaking, welding facilities.

    Composite parts and structures, Electrical Discharge Machining (EDM)

    • Electronics

    Digital and analog electronics, microelectronics, ASIC and electronics board design, cabling and integration.

    Space qualified electronics, EMI/EMC spark chamber

    • Computing

    Resources deployment, operating services, Linux and Windows, computer security, databases, control systems, embedded systems, grid computing.

    Air conditioned datacenter based on free cooling

    • Plasmas et Matériaux

    Plasmas micro-onde distribués, caractérisation expérimentale, modélisation, prospectives, pulvérisation assistée par plasma multi-dipolaire, dépôt physique ou chimique en phase vapeur assisté par plasma, implantation ionique par immersion plasma, gravure plasma, production d’ions H-/D-.

    • Accelerators

    Design and construction of nuclear accelerators, beam dynamics, ion and electron optics, magnetism (simulation and measurements), radiofrequency, high voltage, power supply,  EMC, optical fiber communication, electron polarimetry, photoguns.

    Accelerator driven system, hadrontherapy

    • Ions sources

    Multi charged ion sources, ion beams, ion beams optics, mass spectrometry, electrostatics, high magnetic fields, permanent magnets, high temperature superconducting coils, power electrotechnics, 3D magnetic fields simulations, ion trajectories simulation, ionic beam for multicomponent physical vapor deposition, ion beam implantation.

    Hyperfrequencies from 2.45 up to 60 GHz, UV spectrometry, micro ECR discharges


    1. Convention industrielle de formation par la recherche